| Produktbeschreibung | Intel Xeon W-2225 / 4.1 GHz Prozessor |
| Produkttyp | Prozessor |
| Prozessortyp | Intel Xeon W-2225 |
| Anz. der Kerne | Quad-Core / 8 Threads |
| Cache-Speicher | 8.25 MB |
| Geeignete Sockel | LGA2066 Socket |
| Prozessoranz. | 1 |
| Taktfrequenz | 4.1 GHz |
| Max. Turbo-Taktfrequenz | 4.6 GHz |
| Herstellungsprozess | 14 nm |
| Funktionen | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Demand Based Switching, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel Trusted Execution Technology, Streaming-SIMD-Erweiterungen 4.2, Intel Turbo Boost Technology 2.0, Intel Advanced Vector Extensions (AVX), Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Intel vPro Technology, Idle States, Intel Identity Protection Technology, Intel Secure Key, Intel Advanced Vector Extensions 2 (AVX2.0), Intel TSX-NI, Intel OS Guard, Intel Memory Protection Extensions (MPX), Intel Turbo Boost Max Technology 3.0, Intel Speed Shift Technology, Intel Advanced Vector Extensions 512 (AVX-512), Intel Boot Guard, Intel Deep Learning Boost (DL Boost) |
| Produkttyp | Prozessor |
| Typ / Formfaktor | Intel Xeon W-2225 |
| Anz. der Kerne | Quad-Core |
| Anz. der Threads | 8 Threads |
| Cache-Speicher | 8.25 MB |
| Cache-Speicher-Details | Smart Cache - 8,25 MB |
| Prozessoranz. | 1 |
| Taktfrequenz | 4.1 GHz |
| Max. Turbo-Taktfrequenz | 4.6 GHz |
| Geeignete Sockel | LGA2066 Socket |
| Herstellungsprozess | 14 nm |
| Thermal Design Power (TDP) | 105 W |
| Temperaturspezifikationen | 61 °C |
| PCI Express Revision | 3.0 |
| PCI Express-Konfigurationen | X16, x4, x8 |
| Anz. PCI Express Lanes | 48 |
| Architektur-Merkmale | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Demand Based Switching, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Intel Trusted Execution Technology, Streaming-SIMD-Erweiterungen 4.2, Intel Turbo Boost Technology 2.0, Intel Advanced Vector Extensions (AVX), Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Intel vPro Technology, Idle States, Intel Identity Protection Technology, Intel Secure Key, Intel Advanced Vector Extensions 2 (AVX2.0), Intel TSX-NI, Intel OS Guard, Intel Memory Protection Extensions (MPX), Intel Turbo Boost Max Technology 3.0, Intel Speed Shift Technology, Intel Advanced Vector Extensions 512 (AVX-512), Intel Boot Guard, Intel Deep Learning Boost (DL Boost) |
| Verpackung | OEM/Tray |
| Brand | Intel |